Advanced Packaging Engineer

Position Summary:

We are seeking a highly skilled and motivated Advanced Packaging Engineer with hands-on experience in relevant technologies. The successful candidate will be responsible for the development, optimization, and sustaining of advanced packaging solutions.

Key Responsibilities:

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  • Lead process development and optimization of IC packaging processes (e.g., compression mold, ball attach, laser groove, dicing, die attach, tape & reel, backgrinding / thinning).
  • Define and execute DOE (Design of Experiments) for new materials and process evaluations.
  • Establish process windows and control limits; develop process documentation including FMEA and control plans.
  • Support new product introductions and ramp to production by collaborating closely with manufacturing and Product teams.
  • Identify root causes and drive corrective actions for yield and reliability issues.
  • Troubleshoot process issues, providing continuous improvements to yield, quality, and cycle time.
  • Work with tool vendors and material suppliers to develop next generation technologies.
  • Maintain clear documentation of process changes, results, and improvements through review & control processes.
  • Present findings and suggest improvements to leadership teams.
  
  
  
  

Required Qualifications:

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  • At least 5-10 years of hands-on experience in semiconductor packaging process development (e.g., compression mold, ball attach, laser groove, dicing, die attach, tape & reel, backgrinding / thinning).
  • Knowledge of JEDEC reliability testing and associated failure modes & remedies.
  • Familiarity with materials used in FOWLP/FOPLP ball attach and RDL is an added advantage.
  • US Citizenship Required: This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.
  • Solid understanding of failure analysis and troubleshooting with 8D, Six sigma processes.
  • Strong problem-solving skills and a detail-oriented approach is needed.
  • Ability to communicate technical concepts clearly to both technical and non-technical stakeholders.
  • Strong teamwork, collaboration, and interpersonal skills is required.
  • Ability to work in a fast-paced, cross-functional team environment.
  • BS degree in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, or a related field, MS or PhD degree is a plus.
  
  
  
  

The annual salary range for this role is $110,000 - $165,000. Pay offered is based on many factors including, but not limited to, the job-related experience, skills, education, and credentials of each candidate.

SkyWater offers an exciting environment where the brightest semiconductor minds come together to achieve exceptional results. We offer competitive salary and an opportunity to participate in incentive plans as well other employee financial benefits including 401k match, life insurance and opportunities to purchase SkyWater stock at a discounted rate.

Additionally, SkyWater offers a comprehensive benefits package which promotes a healthy life. This includes benefit eligibility day one, medical, dental, mental health benefits, vision, legal planning, short- and long-term disability, paid time off, paid holidays, an on-site fitness facility, and an on-site self-serve market.

SkyWater complies with federal and state disability laws and makes reasonable accommodations for applicants and employees with disabilities unless doing so would cause an undue hardship. Alternative methods of applying for employment are available to individuals unable to submit an application through this site because of a disability. To request reasonable accommodations, to participate in the job application or interview process, to perform essential job functions, and/or to receive other benefits and privileges of employment, please contact Human Resources at 952-851-5200 or Recruiting@SkyWatertechnology.com.

EOE, including disability/vets