New

Group 07-74 | SRP Intern | Structural & Thermal-Fluids Engineering | Summer 2026

MIT Lincoln Laboratory
United States, Massachusetts, Lexington
244 Wood Street (Show on map)
Aug 15, 2025
Select how often (in days) to receive an alert: JOIN OUR TALENT NETWORK Group 07-74 \| SRP Intern \| Structural & Thermal-Fluids Engineering \| Summer 2026 Apply now Date: Aug 15, 2025 Location: Lexington, MA, US Company: MIT Lincoln Laboratory The Structural & Thermal-Fluids Engineering Group provides innovative multidisciplinary engineering solutions through the development of advanced mechanical and aerospace technologies for sea, ground, air, and space-based prototype systems for national security applications. Examples include the development of structural-material systems for spaceborne imaging and laser communication terminals, heat exchangers for high-flux laser and RF solid-state devices, and aerodynamic designs and multifunctional materials for UAV platforms. New technologies and engineering solutions are developed through high-fidelity models and multidisciplinary simulations, environmental and materials characterization testing, and advanced materials to optimize solutions to meet ever increasing performance, size, weight, and environmental challenges. Job Description Overview MIT Lincoln Laboratory's Group 74 is seeking a Summer 2026 Intern (approximately May through August) to support exciting projects focused on structural, thermal, and fluids engineering challenges. This position offers hands-on experience applying engineering fundamentals to solve real-world problems across aerospace and defense domains. As an intern in this group, you'll contribute to a variety of technical efforts that may include: Creating and running analysis models (finite element structural and/or thermal models, CFD models, etc) Running of internally-developed multidisciplinary simulation software Analyzing model results and generating new designs based on those results Structural and thermal testing and hardware integration Participating in the research and development of new modeling and design capabilities Requirements Currently enrolled in a degree program (Preferred majors: Mechanical Engineering, Aero/Astro, Aerospace Engineering, Mathematics) Completed coursework in Mechanics of Materials and Thermal-Fluids (or equivalent) Selected candidate will be subject to a pre-employment background investigation and must be able to obtain and maintain a Secret level DoD security clearance. MIT Lincoln Laboratory is an Equal Employment Opportunity (EEO) employer. All qualified applicants will receive consideration for employment and will not be discriminated against on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, age, veteran status, disability status, or genetic information; U.S. citizenship is required. Requisition ID: 42246 Nearest Major Market: Boston Job Segment: Thermal Engineering, R&D Engineer, Aerospace Engineering, Security Clearance, Aerospace, Engineering, Government, Aviation Apply now Find similar jobs: Engineering