Packaging Thermal Technologist

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THE ROLE:

In this role, you will serve as a Package-centric Thermal Modeling Architect responsible for defining and driving next-generation packaging-platform architectures through rigorous, model-based decision making and System-Technology Co-Optimization (STCO). You will develop, validate, and apply thermal models to guide SoC/package/board-level architecture, technology selection and integration of electro-thermal and electro-optical capabilities across package, board, and cooling solutions.

THE PERSON:

The ideal candidate is a self-directed technical leader who operates with a high degree of autonomy, communicates with clarity, and collaborates effectively across silicon, package, board, thermal, optical, mechanical, manufacturing, and system architecture teams. You are comfortable owning both the modeling rigor and experimental grounding required for STCO-driven architecture & design decisions and influence product and platform roadmaps for data center and high-performance computing systems.

KEY RESPONSIBILITIES:

• Drive model-based architecture and design decisions for development and qualification of advanced package technologies.
• Develop and maintain thermal and multi-physics models (thermal, thermo-mechanical, electro-thermal and electro-optical) & drive validation strategies partnering with internal and external labs as required to enable STCO across silicon, package, board and platform.
• Engage with suppliers, partners, and component vendors to align material properties, process capabilities, and modeling assumptions with architecture and STCO needs.
• Define targets and strategic direction for thermal and package technology development, assess technology readiness, and influence product roadmaps.
• Serve as a thermal subject-matter expert for SoC, package and system-level architectures with a primary focus on data center platforms.

PREFERRED EXPERIENCE:

• Demonstrated experience owning and driving model-based architecture & design decisions, supported by SoC, package, and system-level thermal modeling, characterization and validation.
• Solid foundation in Thermal and CFD first-principles understanding and multi-physics SoC-package-system-level design & assembly trade-offs.
• Strong background in advanced PCB technologies, including materials, designs, and assembly constraints.
• Experience integrating electro-thermal and electro-optical technologies at the board and package level, informed by modeling and experimental correlation.
• Experience influencing SMT processes, connectors, and assembly strategies from an architecture and modeling perspective.
• Proven relevant industry or research experience with increasing responsibility in modeling-driven system or platform architecture roles.

ACADEMIC CREDENTIALS:

MS or PhD in relevant Engineering disciplines or physics.

LOCATION:

Austin, Texas

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants' needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD's "Responsible AI Policy" is available here.

This posting is for an existing vacancy.